000010306 001__ 10306
000010306 005__ 20141205155713.0
000010306 04107 $$aeng
000010306 046__ $$k2008-10-12
000010306 100__ $$aHwang, Jenn-Shin
000010306 24500 $$aSeismic Retrofit of Microelectronics Factories Using Viscous Dampers

000010306 24630 $$n14.$$pProceedings of the 14th World Conference on Earthquake Engineering
000010306 260__ $$b
000010306 506__ $$arestricted
000010306 520__ $$2eng$$aThe implementation of viscous dampers to microelectronics factories has been previously proved not to affect the micro-vibration of the factories in operation such that the vibration-sensitive manufacturing process will not be interfered. Therefore, a seismic retrofit strategy which employs the viscous dampers installed in between the exterior and interior structures of the “fab” structure (microchip fabrication facilities are often referred to as "fabs" in micro-electronics industry) is proposed in the study. The design formulas corresponding to the proposed retrofit method is derived using the non-classical damping theory. Based on the study, it is found that the added damping ratio to the fab structure depends greatly on the frequency ratio of the two structures in addition to the damping coefficients of the added dampers. Outside the band width of the frequency ratio in which the added damping ratio is very sensitive to the variation of the frequency ratio, the added damping ratio can be well captured using the classical damping theory.

000010306 540__ $$aText je chráněný podle autorského zákona č. 121/2000 Sb.
000010306 653__ $$aseismic retrofit, viscous damper, micro-electronics factory, seismic design, passive control

000010306 7112_ $$a14th World Conference on Earthquake Engineering$$cBejing (CN)$$d2008-10-12 / 2008-10-17$$gWCEE15
000010306 720__ $$aHwang, Jenn-Shin$$iWang, Shiang-Jung$$iHuang, Yin-Nan$$iChen, Jay-Fu
000010306 8560_ $$ffischerc@itam.cas.cz
000010306 8564_ $$s609271$$uhttps://invenio.itam.cas.cz/record/10306/files/05-01-0079.pdf$$yOriginal version of the author's contribution as presented on CD, Paper ID: 05-01-0079.
000010306 962__ $$r9324
000010306 980__ $$aPAPER