000013168 001__ 13168
000013168 005__ 20161114160330.0
000013168 04107 $$aeng
000013168 046__ $$k2009-06-22
000013168 100__ $$aAmy, R.
000013168 24500 $$aSimplified analysis of pcbs response to random vibrations

000013168 24630 $$n2.$$pComputational Methods in Structural Dynamics and Earhquake Engineering
000013168 260__ $$bNational Technical University of Athens, 2009
000013168 506__ $$arestricted
000013168 520__ $$2eng$$aThis paper summarizes the results of a research programme that was carried out with the aim to offer an alternative to the standard practice implemented in the aerospace industry to carry out the mechanical design of enclosures containing Printed Circuit Boards (PCBs), and in particular the assessment of the PCBs capability to withstand the launch vibration environment. The response of the PCBs to the vibration environment was calculated using standard FEA and the “smearing” technique (i.e. the electronic components on the PCB are not geometrically modelled, and their influence on the boards dynamics is reproduced by smearing their mass and stiffness contribution on the shell elements representing the board). The level of accuracy that these FE models typically achieve and the influence of the modelling simplifications have been quantified. This allows to calculate suitable Safety Factors that can be applied in specific circumstances to compensate for the inaccuracies in the predictions. The paper then briefly describes a test campaign carried out with the aim to correlate the failure of electronic components on the PCBs with some typical FEA output. The capability to predict the response with a known level of accuracy (compensated by suitable Safety Factors), together with reliable failure criteria for the electronic components on the board, allow us to assess whether or not a design will be able to withstand a particular environment. Although this process requires a certain amount of work to be carried out upfront, its implementation in an industrial environment is relatively straight forward, with the main benefit of reducing considerably the current “trial and error” experimental work.

000013168 540__ $$aText je chráněný podle autorského zákona č. 121/2000 Sb.
000013168 653__ $$aElectronic packaging vibrations, electronic components failure, FE smearing. Abstract. This paper summarizes the results of a research programme that was carried out with the aim to offer an alternative to the standard practice implemented in the aerospace industry to carry out the mechanical design of enclosures containing Printed Circuit Boards (PCBs), and in particular the assessment of the PCBs capability to withstand the launch vibration environment. The response of the PCBs to the vibration environment was calculated using standard FEA and the “smearing” technique (i.e. the electronic components on the PCB are not geometrically modelled, and their influence on the boards dynamics is reproduced by smearing their mass and stiffness contribution on the shell elements representing the board). The level of accuracy that these FE models typically achieve and the influence of the modelling simplifications have been quantified. This allows to calculate suitable Safety Factors that can be applied in specific circumstances to compensate for the inaccuracies in the predictions. The paper then briefly describes a test campaign carried out with the aim to correlate the failure of electronic components on the PCBs with some typical FEA output. The capability to predict the response with a known level of accuracy (compensated by suitable Safety Factors), together with reliable failure criteria for the electronic components on the board, allow us to assess whether or not a design will be able to withstand a particular environment. Although this process requires a certain amount of work to be carried out upfront, its implementation in an industrial environment is relatively straight forward, with the main benefit of reducing considerably the current “trial and error” experimental work.

000013168 7112_ $$aCOMPDYN 2009 - 2nd International Thematic Conference$$cIsland of Rhodes (GR)$$d2009-06-22 / 2009-06-24$$gCOMPDYN2009
000013168 720__ $$aAmy, R.$$iAglietti G., S.$$iRichardson, G.
000013168 8560_ $$ffischerc@itam.cas.cz
000013168 8564_ $$s1886923$$uhttps://invenio.itam.cas.cz/record/13168/files/CD224.pdf$$yOriginal version of the author's contribution as presented on CD, section: Uncertainty analysis in structural dynamics and earthquake engineering - ii.
000013168 962__ $$r13074
000013168 980__ $$aPAPER