000013873 001__ 13873
000013873 005__ 20161115094004.0
000013873 04107 $$aeng
000013873 046__ $$k2016-08-21
000013873 100__ $$aVilleneuve, Thierry
000013873 24500 $$aThree-mode heat transfer simulations in parallelogrammic air enclosures

000013873 24630 $$n24.$$p24th International Congress of Theoretical and Applied Mechanics - Book of Papers
000013873 260__ $$bInternational Union of Theoretical and Applied Mechanics, 2016
000013873 506__ $$arestricted
000013873 520__ $$2eng$$aThe impact of the three heat transfer modes on the thermal diode potential of parallelogrammic air-filled enclosures stacked between two isothermal vertical walls is assessed for different parametric cases. Focusing on a single enclosure in this paper, it is found that the thermal diode potential significantly decreases when conduction and radiation are taken into account in comparison with the classical problem of the pure-convection cavity.

000013873 540__ $$aText je chráněný podle autorského zákona č. 121/2000 Sb.
000013873 653__ $$a

000013873 7112_ $$a24th International Congress of Theoretical and Applied Mechanics$$cMontreal (CA)$$d2016-08-21 / 2016-08-26$$gICTAM2016
000013873 720__ $$aVilleneuve, Thierry
000013873 8560_ $$ffischerc@itam.cas.cz
000013873 8564_ $$s166902$$uhttps://invenio.itam.cas.cz/record/13873/files/PO.FM05-1.09.22.pdf$$yOriginal version of the author's contribution as presented on CD, XMLout( page 761, code PO.FM05-1.09.22).
000013873 962__ $$r13812
000013873 980__ $$aPAPER