000014229 001__ 14229
000014229 005__ 20161115100145.0
000014229 04107 $$aeng
000014229 046__ $$k2016-08-21
000014229 100__ $$aKeer, Leon
000014229 24500 $$aA micromechanical damage model for solder joints with an intermetallic compound layer

000014229 24630 $$n24.$$p24th International Congress of Theoretical and Applied Mechanics - Book of Papers
000014229 260__ $$bInternational Union of Theoretical and Applied Mechanics, 2016
000014229 506__ $$arestricted
000014229 520__ $$2eng$$aIntermetallic compound formation is critical to the reliability of microelectronic interconnections, especially for flip chip solder joints. It is well known that the presence of an intermetallic compound layer will significantly affect the mechanical behavior of solder joints due to its brittleness, while the solder joints generally exhibit ductile behavior. On the other hand, the thermal expansion coefficients of the intermetallic compound and solder materials are different. In this research, a micromechanical damage model is developed to study the solder joints combined with intermetallic compound layers based on the equivalent inclusion method. Taking the intermetallic compound layer as an inclusion and the solder joints as the matrix, the relationship between these two portions can be obtained by treating the intermetallic compound in this manner. The plastic strain, misfit strain and thermal strain can be determined and are included in the developed model, as eigenstrains.

000014229 540__ $$aText je chráněný podle autorského zákona č. 121/2000 Sb.
000014229 653__ $$a

000014229 7112_ $$a24th International Congress of Theoretical and Applied Mechanics$$cMontreal (CA)$$d2016-08-21 / 2016-08-26$$gICTAM2016
000014229 720__ $$aKeer, Leon
000014229 8560_ $$ffischerc@itam.cas.cz
000014229 8564_ $$s126317$$uhttps://invenio.itam.cas.cz/record/14229/files/PO.SM05-1.05.250.pdf$$yOriginal version of the author's contribution as presented on CD,  page 2127, code PO.SM05-1.05.250
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000014229 962__ $$r13812
000014229 980__ $$aPAPER