000014323 001__ 14323
000014323 005__ 20161115100148.0
000014323 04107 $$aeng
000014323 046__ $$k2016-08-21
000014323 100__ $$aLi, Zhen
000014323 24500 $$aA Novel Material Model for the Large-Scale Simulation of Temperature Dependent Inelasticity

000014323 24630 $$n24.$$p24th International Congress of Theoretical and Applied Mechanics - Book of Papers
000014323 260__ $$bInternational Union of Theoretical and Applied Mechanics, 2016
000014323 506__ $$arestricted
000014323 520__ $$2eng$$aSolder is a fundamental material used to connect chip to chip carrier. The reliability of electronic packaging is limited by the ability of the chip/chip carrier interconnects (solder balls) to withstand thermo-mechanical strain. The primary cause for this strain is thermal mismatch in properties among the constituent materials. In this study, a novel material model for simulating the mechanical response of the solder balls during the packaging process is developed. The model includes Norton creep, J2 plasticity and thermo-elasticity within a finite strain framework. A finite element based numerical method, together with a return-mapping algorithm, is developed from the constitutive equations. The numerical routine is implemented into the multi-physics code ALBANY for simulating large-scale solder ball problems on high performance computers.

000014323 540__ $$aText je chráněný podle autorského zákona č. 121/2000 Sb.
000014323 653__ $$a

000014323 7112_ $$a24th International Congress of Theoretical and Applied Mechanics$$cMontreal (CA)$$d2016-08-21 / 2016-08-26$$gICTAM2016
000014323 720__ $$aLi, Zhen
000014323 8560_ $$ffischerc@itam.cas.cz
000014323 8564_ $$s124038$$uhttps://invenio.itam.cas.cz/record/14323/files/PO.SM13-1.08.183.pdf$$yOriginal version of the author's contribution as presented on CD,  page 2744, code PO.SM13-1.08.183
.
000014323 962__ $$r13812
000014323 980__ $$aPAPER