000014833 001__ 14833
000014833 005__ 20161115100203.0
000014833 04107 $$aeng
000014833 046__ $$k2016-08-21
000014833 100__ $$aLu, Hua
000014833 24500 $$aDetermination of Critical Loads for Embedded RF PA Assembly (INVITED)

000014833 24630 $$n24.$$p24th International Congress of Theoretical and Applied Mechanics - Book of Papers
000014833 260__ $$bInternational Union of Theoretical and Applied Mechanics, 2016
000014833 506__ $$arestricted
000014833 520__ $$2eng$$aPresented is an experimental mechanics based methodology and a case study exemplifying a novel, effective and efficient reliability evaluation for a package. Under the study is a prototype of an advanced embedded RF (radio frequency) PA (power amplifier). The study focuses on determining its tolerance to thermal loads and mechanical bending. The reliability attributes are the key specifications for the package qualification, which characterize the assembly’s safe operation limits. Localized sites of structural weakness in a new design are identified first backed by theories of interfacial mechanics. Novel opto-mechanistic based metrological techniques including optical imaging and shadow moire are applied to measure strains in these areas leading to quantitatively determined failure critical parameters of the package, which thus facilitate the design evaluation, modification and optimization.

000014833 540__ $$aText je chráněný podle autorského zákona č. 121/2000 Sb.
000014833 653__ $$a

000014833 7112_ $$a24th International Congress of Theoretical and Applied Mechanics$$cMontreal (CA)$$d2016-08-21 / 2016-08-26$$gICTAM2016
000014833 720__ $$aLu, Hua
000014833 8560_ $$ffischerc@itam.cas.cz
000014833 8564_ $$s238848$$uhttps://invenio.itam.cas.cz/record/14833/files/TS.FS03-1.03.pdf$$yOriginal version of the author's contribution as presented on CD,  page 3130, code TS.FS03-1.03
.
000014833 962__ $$r13812
000014833 980__ $$aPAPER