000015330 001__ 15330
000015330 005__ 20161115100218.0
000015330 04107 $$aeng
000015330 046__ $$k2016-08-21
000015330 100__ $$aLepage, William
000015330 24500 $$aThermomechanical Characterization of Shape Memory Alloy Mode I Fracture Behavior

000015330 24630 $$n24.$$p24th International Congress of Theoretical and Applied Mechanics - Book of Papers
000015330 260__ $$bInternational Union of Theoretical and Applied Mechanics, 2016
000015330 506__ $$arestricted
000015330 520__ $$2eng$$aThis work presents a combination of full-field surface displacement and temperature measurements through the use of stereo dig- ital image correlation (3—D DIC) and infrared thermography to characterize the thermomechanical behavior of NiTi SMA during quasistatic mode I fracture. Previous experimental works have characterized the mode I fracture behavior of NiTi shape memory alloy (SMA) using a variety of techniques, but little experimental work has connected the thermal and mechanical responses of SMA during fracture.

000015330 540__ $$aText je chráněný podle autorského zákona č. 121/2000 Sb.
000015330 653__ $$a

000015330 7112_ $$a24th International Congress of Theoretical and Applied Mechanics$$cMontreal (CA)$$d2016-08-21 / 2016-08-26$$gICTAM2016
000015330 720__ $$aLepage, William
000015330 8560_ $$ffischerc@itam.cas.cz
000015330 8564_ $$s114979$$uhttps://invenio.itam.cas.cz/record/15330/files/TS.SM09-4.05.pdf$$yOriginal version of the author's contribution as presented on CD,  page 2430, code TS.SM09-4.05
.
000015330 962__ $$r13812
000015330 980__ $$aPAPER