000015364 001__ 15364
000015364 005__ 20161115100219.0
000015364 04107 $$aeng
000015364 046__ $$k2016-08-21
000015364 100__ $$aYalcinkaya, Tuncay
000015364 24500 $$aMicrostructure evolution in plasticity

000015364 24630 $$n24.$$p24th International Congress of Theoretical and Applied Mechanics - Book of Papers
000015364 260__ $$bInternational Union of Theoretical and Applied Mechanics, 2016
000015364 506__ $$arestricted
000015364 520__ $$2eng$$aDeformation of polycrystalline metallic materials induces intrinsic formation and evolution of various types of microstructures at different length scales due to different underlying physical mechanisms affecting the plasticity, damage and fracture behavior. At nanomicro scale metals under irradiation develop certain zones free from irradiation and localization occurs in these areas as so-called clear bands affecting the ductility and the failure of the material. At meso scale dislocations form various dislocation cell structures induced by the deformation. At grain level polycrystalline materials develop stress and strain localization around the grain boundaries which could lead to inter-granular cracking e.g. through stress corrosion cracking. These are some examples to illustrate the influence of the microstructure on the global behavior of materials. In this context, the current work addresses different microstructure formation examples, focusing especially on the inter-granular deformation localization, through a strain gradient crystal plasticity framework and links it to different failure mechanisms.

000015364 540__ $$aText je chráněný podle autorského zákona č. 121/2000 Sb.
000015364 653__ $$a

000015364 7112_ $$a24th International Congress of Theoretical and Applied Mechanics$$cMontreal (CA)$$d2016-08-21 / 2016-08-26$$gICTAM2016
000015364 720__ $$aYalcinkaya, Tuncay
000015364 8560_ $$ffischerc@itam.cas.cz
000015364 8564_ $$s147009$$uhttps://invenio.itam.cas.cz/record/15364/files/TS.SM10-5.03.pdf$$yOriginal version of the author's contribution as presented on CD,  page 2512, code TS.SM10-5.03
.
000015364 962__ $$r13812
000015364 980__ $$aPAPER