000015393 001__ 15393
000015393 005__ 20161115100220.0
000015393 04107 $$aeng
000015393 046__ $$k2016-08-21
000015393 100__ $$aElhebeary, Mohamed
000015393 24500 $$aMechanical Characterization of Materials At Micro/Nanoscale Under Bending

000015393 24630 $$n24.$$p24th International Congress of Theoretical and Applied Mechanics - Book of Papers
000015393 260__ $$bInternational Union of Theoretical and Applied Mechanics, 2016
000015393 506__ $$arestricted
000015393 520__ $$2eng$$aThis paper presents a new method for testing materials at the micro/nanoscale under bending in-situ in SEM and TEM. The method consists of a straining stage with built-in force and displacement sensors. The sample is co-fabricated with the stage to eliminate any misalignment error. The method is applied to test the strength of silicon micro-beams under bending. The study reveals significant strengthening of silicon compared to that under uniform tension. This strengthening is contributed by stress localization near the surface of the beams close to the anchors, and the stress gradient from the surface to the neutral axis. Stress localization reduces the incidence of flaws that typically trigger premature fracture in the uniformly loaded samples, i.e., uniaxial tension. Most MEMS supporting beams are subjected to bending during operation. Their design landscape can be broadened by exploiting the effective strengthening of materials under bending — a paradigm that remains untapped to date.

000015393 540__ $$aText je chráněný podle autorského zákona č. 121/2000 Sb.
000015393 653__ $$a

000015393 7112_ $$a24th International Congress of Theoretical and Applied Mechanics$$cMontreal (CA)$$d2016-08-21 / 2016-08-26$$gICTAM2016
000015393 720__ $$aElhebeary, Mohamed
000015393 8560_ $$ffischerc@itam.cas.cz
000015393 8564_ $$s180043$$uhttps://invenio.itam.cas.cz/record/15393/files/TS.SM12-1.05.pdf$$yOriginal version of the author's contribution as presented on CD,  page 2613, code TS.SM12-1.05
.
000015393 962__ $$r13812
000015393 980__ $$aPAPER