Computational Issues in the Dynamics of High-Speed Grinding


Abstract eng:
Grinding is a process, in which material is mechanically removed from the surface of a workpiece by means of a set of hard grits which are statistically distributed over the circumference of a spinning grinding wheel. Grinding aims at achieving a precise surface roughness and precise workpiece dimensions. Grinding processes which operate with high material removal speeds build the special class of high-speed grinding. Grinding wheel and workpiece are both supported by a grinding machine which, in addition, provides the kinematics and the mechanical energy necessary for the precise material removal. The requirement of a high amount of precision in the process result requires also a high amount of machine strength, stiffness and stability, particularly in the dynamic regime. Indeed, the forces caused by the material removal process result in a dynamical excitation of the grinding machine with a significant impact on the workpiece surface and dimensions. In the past fifty years, there has been a large number of works, which tried to model and simulate grinding processes. Recent works use extensively computer simulations to investigate the physical phenomena taking place during grinding, in general, and at the contact zone between grinding wheel and workpiece, in particular. The present work presents novel issues to model and simulate high-speed grinding processes. Especially, the elastodynamical and thermomechanical behavior of the grinding wheel as well as the way the machine interacts with the process are presented with different examples in detail.

Contributors:
Publisher:
National Technical University of Athens, 2011
Conference Title:
Conference Title:
COMPDYN 2011 - 3rd International Thematic Conference
Conference Venue:
Island of Corfu (GR)
Conference Dates:
2011-05-25 / 2011-05-28
Rights:
Text je chráněný podle autorského zákona č. 121/2000 Sb.



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 Record created 2016-11-14, last modified 2016-11-14


Original version of the author's contribution as presented on CD, section: Semi - Plenary Lectures.:
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