Examination of interactions between deformation mechanisms in fcc thin films using SEM-DIC

Abstract eng:
This presentation will discuss an on-going experimental investigation of the interaction between dislocation glide and grain boundary sliding (GBS) in columnar Al thin films under tensile loading. Due to the oligocrystalline microstructure of the specimen, these mechanisms can be characterized without sub-surface ambiguity. In this investigation, tensile strain was applied in-SEM to Al films with thicknesses of hundreds of nanometers, using a custom thermal actuator MEMS device, and full-field surface displacements were measured using a high-resolution combination of scanning electron microscopy and digital image correlation. Novel methods for microscale pattern deposition and SEM spatial and temporal distortion corrections were utilized for high accuracy results. Analysis of the resulting full-field, high resolution data linking deformation behavior and underlying texture provided insight into the interaction between GBS and dislocation-based deformation mechanisms in Al thin films.

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