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The Institute of Theoretical and Applied Mechanics
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Original version of the author's contribution as presented on CD, page 2127, code PO.SM05-1.05.250 .:
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A micromechanical damage model for solder joints with an intermetallic compound layer
Keer, Leon
Intermetallic compound formation is critical to the reliability of microelectronic interconnections, especially for flip chip solder joints. It is well known that the pre [...]
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