A micromechanical damage model for solder joints with an intermetallic compound layer

Abstract eng:
Intermetallic compound formation is critical to the reliability of microelectronic interconnections, especially for flip chip solder joints. It is well known that the presence of an intermetallic compound layer will significantly affect the mechanical behavior of solder joints due to its brittleness, while the solder joints generally exhibit ductile behavior. On the other hand, the thermal expansion coefficients of the intermetallic compound and solder materials are different. In this research, a micromechanical damage model is developed to study the solder joints combined with intermetallic compound layers based on the equivalent inclusion method. Taking the intermetallic compound layer as an inclusion and the solder joints as the matrix, the relationship between these two portions can be obtained by treating the intermetallic compound in this manner. The plastic strain, misfit strain and thermal strain can be determined and are included in the developed model, as eigenstrains.

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