Three-mode heat transfer simulations in parallelogrammic air enclosures

Abstract eng:
The impact of the three heat transfer modes on the thermal diode potential of parallelogrammic air-filled enclosures stacked between two isothermal vertical walls is assessed for different parametric cases. Focusing on a single enclosure in this paper, it is found that the thermal diode potential significantly decreases when conduction and radiation are taken into account in comparison with the classical problem of the pure-convection cavity.

• Export as: BibTeX | MARC | MARCXML | DC | EndNote | NLM | RefWorks
• Add to your basket