A Novel Material Model for the Large-Scale Simulation of Temperature Dependent Inelasticity

Abstract eng:
Solder is a fundamental material used to connect chip to chip carrier. The reliability of electronic packaging is limited by the ability of the chip/chip carrier interconnects (solder balls) to withstand thermo-mechanical strain. The primary cause for this strain is thermal mismatch in properties among the constituent materials. In this study, a novel material model for simulating the mechanical response of the solder balls during the packaging process is developed. The model includes Norton creep, J2 plasticity and thermo-elasticity within a finite strain framework. A finite element based numerical method, together with a return-mapping algorithm, is developed from the constitutive equations. The numerical routine is implemented into the multi-physics code ALBANY for simulating large-scale solder ball problems on high performance computers.

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