Determination of Critical Loads for Embedded RF PA Assembly (INVITED)

Abstract eng:
Presented is an experimental mechanics based methodology and a case study exemplifying a novel, effective and efficient reliability evaluation for a package. Under the study is a prototype of an advanced embedded RF (radio frequency) PA (power amplifier). The study focuses on determining its tolerance to thermal loads and mechanical bending. The reliability attributes are the key specifications for the package qualification, which characterize the assembly’s safe operation limits. Localized sites of structural weakness in a new design are identified first backed by theories of interfacial mechanics. Novel opto-mechanistic based metrological techniques including optical imaging and shadow moire are applied to measure strains in these areas leading to quantitatively determined failure critical parameters of the package, which thus facilitate the design evaluation, modification and optimization.

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